| Machine and hand placement capabilities, which include: |
| - Placing packages as small as 0402. |
| - BGA, SOIC, PLCC, QFP are all standard packages for us. |
| - We can also handle ultra fine pitch to 0.015”. |
| - X-ray and AOI equipment. |
| - Prototype through pre-production and small volume to high volume capacity. |
Our expertise with SMT assembly combined with through-hole, mixed technology, wire harnessing and electro-mechanical assembly make Caladena the optimum choice for all your assembly requirements.
Contact us and experience the difference and quality of Caladena!
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